Semi-conductor chip test probe

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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Details

324762, G01R 1073

Patent

active

056252986

ABSTRACT:
This discloses a probe structure which does not rely on cantilevered wire and which has improved and controlled contact pressure between the probe contacts and the I/O pads on a semi-conductor chip and which comprises a plurality of conductive contact electrodes, electrically coupled to respective leads, formed, on a film stretched across a respective plurality of cavities established in a substrate. The cavities and the contact electrodes are aligned to one another and both positionally match selected I/O pads existing on a semi-conductor chip to be probed.
Also disclosed is a probe utilizing a cantilevered, metalized oxide tongue extending across a cavity.

REFERENCES:
patent: 5012187 (1991-04-01), Littlebury
patent: 5264787 (1993-11-01), Woith et al.

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