Self tooling, molded electronics packaging

Details Self tooling, molded electronics packaging Self tooling, molded electronics packaging

1992-10-06

1994-02-15

Coan, James F.

Package making

Methods

With contents treating

53472, 53474, 53442, B65B 5302, B65B 3102, B65B 2300

Patent

active

052856194

ABSTRACT:
A method of protecting an electronic component from the environment comprising the steps of providing a bag made from thermoplastic heat shrink material, inserting said electronic component into said bag, injecting a liquid polymerizable resin into said bag, heating said bag to shrink it about said electronic component and said resin, and curing said resin.

REFERENCES:
patent: 3909504 (1975-09-01), Browne
patent: 4267927 (1981-05-01), English, Jr.
patent: 4674268 (1987-06-01), Gavronsky et al.
patent: 4856655 (1989-08-01), Barsky
patent: 5033253 (1991-07-01), Havens et al.

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