Self-supported ultra thin silicon wafer process

Details Self-supported ultra thin silicon wafer process Self-supported ultra thin silicon wafer process

1999-06-17

2000-12-19

Bowers, Charles

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

438774, 257619, 257678, H01L 2146

Patent

active

06162702&

ABSTRACT:
A silicon wafer 2 has an ultra thin central portion 2 that is supported by a circumferential rim 3 of thicker silicon. The central region is thinned by conventional means using conventional removal apparatus. As an alternative method, the central portion is removed using a photoresist mask or a combination of a photoresist mask and a hard mask.

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