Self packaging chip mount

Details Self packaging chip mount Self packaging chip mount

1988-08-23

1990-03-13

Tolin, Gerald P.

Electricity: electrical systems and devices

Miscellaneous

361386, 361398, 439 71, H05K 330

Patent

active

049087363

ABSTRACT:
A method of self packaging an integrated circuit chip (10) on a printed circuit board (14) where conductive leads (16) form an electrical connection with interconnect leads (12) on the printed circuit board (14). A centering frame (22) placed on the printed circuit board serves to align the leads (12 and 16). A cooling cap (34) which dissipates heat from the integrated circuit chip (10) is placed over the centering frame (22) and integrated circuit chip (10). In one embodiment, the leads (12 and 16) form a pressure fit and the cooling cap (34) forces the pressure-fit electrical connections. In another embodiment, the leads (12 and 16) make rubbing contact with each other.

REFERENCES:
patent: 3629787 (1971-12-01), Wilson
patent: 3780352 (1973-12-01), Redwanz
patent: 3795884 (1974-03-01), Kotaka
patent: 3832769 (1974-09-01), Olyphant, Jr.
patent: 4169642 (1979-10-01), Mouissie
patent: 4251852 (1981-02-01), Ecker
patent: 4363076 (1982-12-01), McIver
patent: 4410927 (1983-10-01), Butt
patent: 4517624 (1985-05-01), Wessely
patent: 4658331 (1987-04-01), Berg
patent: 4716494 (1987-12-01), Bright
J. Schroeder, "Introduction to the SICON", Extended Abstracts of the 1984 VLSI Packaging Workship (IEEE), Santa Clara, California (Sep. 10-11, 1984), pp. 27-32.
Article entitled "Burn-In Chip-Carrier Socket Permits Airflow on Six Sides", Electronic Products, Dec. 12, 1984, pp. 32 and 36.

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