Self-monitoring electroless plating solution

Details Self-monitoring electroless plating solution Self-monitoring electroless plating solution

1979-02-05

1980-10-21

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, 106 127, 427437, 427438, 4274431, C23C 302

Patent

active

042292182

ABSTRACT:
This invention relates to monitoring the concentration of a component dissolved in solution where the component imparts a perceptible color to the solution and varies in concentration with use of the solution.
The invention is based upon use of a colorant of a fixed optical density that absorbs light in a different region of the visible spectrum than the monitored component. As the monitored component varies in concentration with use of the solution, the optical density of that component in solution varies as a function of its concentration and consequently, the amount of light, i.e., the intensity of light, passing through the solution will also vary as a function of concentration. Since the optical density of the colorant remains fixed during use, the optical density of the monitored component changes relative to the optical density of the colorant during use of the solution. Because the monitored component and colorant absorb light in different regions of the visible spectrum and their optical densities change relative to each other, there results a perceptible color change as a function of concentration that may be seen visually or measured by instrumentation.

REFERENCES:
patent: 3348969 (1967-10-01), Katz
patent: 3532519 (1970-10-01), Hirohata et al.
patent: 3650957 (1972-03-01), Shipley et al.
patent: 3728137 (1973-04-01), Shipley et al.
patent: 3928670 (1975-12-01), Brummett et al.
patent: 3951602 (1976-04-01), Thompson
patent: 4002786 (1977-01-01), Hirohata et al.
patent: 4096301 (1978-06-01), Slominski et al.
patent: 4118234 (1978-10-01), Jans
Shipley, Cuposit 7012 Copper Color Indicator System, 3/74.
Shipley, Analysis of Copper Baths Using Shipley Comparator, 9/74.
Shipley, Analysis of Electroless Nickel Baths Using Shipley Comparator, 4/76.
Shipley, Shipley Comparators, 5/76.

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