Self-locking conductive pin for printed wiring substrate electro

Details Self-locking conductive pin for printed wiring substrate electro Self-locking conductive pin for printed wiring substrate electro

1999-04-09

2000-11-07

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 522, 361818, 363141, H05K 720

Patent

active

061445576

ABSTRACT:
An electronics case, a method of manufacturing the same and a power module incorporating the case. In one embodiment, the case includes: (1) an enclosure including a metal substrate and a dielectric material located on inner surfaces of the enclosure that insulate the substrate from electronics components located within the enclosure, the enclosure having an aperture on a major surface thereof and (2) an electrically conductive pin, passing through the aperture and an interior of the enclosure to emerge from the enclosure at a point opposite the major surface, the pin functioning both as a heat sink mount for the case and a case ground pin for the substrate.

REFERENCES:
patent: 4325103 (1982-04-01), Ito
patent: 4502098 (1985-02-01), Brown
patent: 4599680 (1986-07-01), Gibson
patent: 5835350 (1998-11-01), Stevens
patent: 5901040 (1999-05-01), Cromwell
patent: 5905622 (1999-05-01), Finlay, Sr.
patent: 5907478 (1999-05-01), Watanabe
patent: 6031732 (2000-02-01), Koike

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