Self-leveling reflow solder head with double pivot

Details Self-leveling reflow solder head with double pivot Self-leveling reflow solder head with double pivot

1991-11-22

1992-09-29

Heinrich, Samuel M.

Metal fusion bonding

Including means to force or clamp work portions together...

Work portion comprises electrical component

228 55, 2281802, 267160, 267182, B23K 300, B23K 2002

Patent

active

051508273

ABSTRACT:
A reflow solder head has its heater bar (30) mounted so as to cause the heater bar to contact a tilted reflow surface (50) and align itself with the tilted surface without tip skid. The heater bar is mounted to its movable drive ram (40) by two independent pivots (36,42), both nominally positioned on a line normal to and in the center of the heater bar itself. The first pivot (36) closer to the heater bar allows the heater bar to rotate about its first point of contact (54) with the tilted reflow surface. The second pivot (42) allows lateral movement of the first pivot (36) without tip skid during the rotation of the heater bar about its first point of contact. This double pivot mechanism eliminates the tendency of the heater bar to skid along the reflow surface.

REFERENCES:
patent: 2793028 (1957-05-01), Wheeler
patent: 3081552 (1963-03-01), Reason
patent: 4768702 (1988-09-01), Takahashi et al.
patent: 4851648 (1989-07-01), Jacobs et al.
patent: 4875614 (1989-10-01), Cipolla et al.
patent: 4982890 (1991-01-01), Schuster et al.

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