Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-03-06
2007-03-06
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S702000, C361S709000, C361S710000, C361S719000, C439S330000, C439S331000
Reexamination Certificate
active
11072977
ABSTRACT:
A circuit board assembly may include a heat sink that couples with a surface a circuit module installed on the circuit board. The heat sink may automatically couple to the surface of the circuit module when the circuit module is installed on the circuit board. The heat sink may include a thermal interface element that contacts the surface of the circuit module. A biasing element may be coupled between the body and the base to urge a body of the heat sink into contact with the circuit module when the circuit module is installed on the circuit board. In some embodiments, a heat sink may automatically couple with the circuit module when a locking member for the circuit module is actuated to a closed position. In some embodiments, a heat sink may automatically couple with a circuit module when an ejector for the circuit module is actuated. In some embodiments, a heat sink may include an ejector and a locking member for a circuit module.
REFERENCES:
patent: 5161087 (1992-11-01), Frankeny et al.
patent: 5380213 (1995-01-01), Piorunneck et al.
patent: 5865639 (1999-02-01), Fuchigami et al.
patent: 5966287 (1999-10-01), Lofland et al.
patent: 5966289 (1999-10-01), Hastings et al.
patent: 6086387 (2000-07-01), Gallagher et al.
patent: 6213806 (2001-04-01), Choy
patent: 6447322 (2002-09-01), Yan et al.
patent: 6634890 (2003-10-01), Peterson et al.
patent: 6746270 (2004-06-01), Peterson et al.
patent: 6945792 (2005-09-01), Hayakawa
patent: 7007741 (2006-03-01), Sen et al.
patent: 7030638 (2006-04-01), Stutzman
patent: 2003/0032322 (2003-02-01), Nakamura et al.
patent: 410107468 (1998-04-01), None
Olesiewicz Timothy W.
Stewart Thomas E.
Datskovskiy Michael
Kivlin B. Noäl
Meyertons Hood Kivlin Kowert & Goetzel P.C.
Sun Microsystems Inc.
Thompson Chris D.
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