Self-identifying stacked die semiconductor components

Details Self-identifying stacked die semiconductor components Self-identifying stacked die semiconductor components

2008-01-11

2009-08-11

Yoha, Connie C (Department: 2827)

Static information storage and retrieval

Interconnection arrangements

C365S230060, C365S230090

Reexamination Certificate

active

07573733

ABSTRACT:
A semiconductor die having a functional circuit (e.g., a memory array) and a decode circuit suitable for use in a stacked die semiconductor component (e.g., a random access memory component) is described. The decode circuit permits individual die in a stacked die structure to automatically determine their location or position in the stack and, in response to this determination, selectively pass one or more external control signals (e.g., chip select and clock enable signals) to the decode circuit's associated functional circuit based on inter-die connection patterns. This “self-configuring” capability permits all die designated for a specified functionality (e.g., a memory module including four vertically aligned die) to be uniformly or consistently manufactured. This, in turn, can reduce the cost to manufacture stacked die components.

REFERENCES:
patent: 5173766 (1992-12-01), Long et al.
patent: 5291061 (1994-03-01), Ball
patent: 6168973 (2001-01-01), Hubbard
patent: 6218895 (2001-04-01), De et al.
patent: 6400008 (2002-06-01), Farnworth
patent: 6696318 (2004-02-01), Milla
patent: 6706557 (2004-03-01), Koopmans
patent: 6813193 (2004-11-01), Vogelsang

Affiliated with

Also associated with

Rating

Self-identifying stacked die semiconductor components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Self-identifying stacked die semiconductor components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Self-identifying stacked die semiconductor components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4094175