Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2000-03-06
2001-06-26
Dunn, Tom (Department: 1725)
Metal fusion bonding
Process
Plural joints
C228S056100, C228S034000, C228S259000
Reexamination Certificate
active
06250537
ABSTRACT:
TECHNICAL FIELD
The present invention relates to devices for soldering electrical connections.
BACKGROUND OF THE INVENTION
Many automotive control systems include component parts such as sensors and solenoids. Often, electrical connections in these sensors and solenoids are made by an automated soldering apparatus. In a common process, two or more insulated wires are dipped into a thimble filled with liquid solder to form an electrical connection and then removed.
The present invention recognizes that as the insulated wires are joined by this process, a portion of the insulating jacket nearest to the soldered connection melts and becomes a waste product that sticks to the thimble as the connected wires are removed. Over time, this waste product, commonly known as dross, accumulates along the upper edge of the thimble. The accumulated dross can decrease the quality of soldered connections and must be removed regularly to prevent failure of these connections.
The present invention understands that the dross may be removed manually after a predetermined number of soldering cycles. Unfortunately, manually removing the dross increases the down time of the soldering machine and as such, increases production costs. Moreover, manually removing the dross can increase the likelihood of injury to a machine operator from the toxic lead fumes emitted by the solder or from the high operating temperatures necessary to keep the solder molten.
The present invention has recognized these prior art drawbacks, and has provided the below-disclosed solutions to one or more of the prior art deficiencies.
SUMMARY OF THE INVENTION
A self-cleaning soldering thimble assembly includes a thimble having at least one side and a scraper closely spaced from the side such that it can scrape any dross on the side as it moves along the side. In a preferred embodiment, the thimble defines a top and the thimble is movable between an extended position, wherein the scraper is distanced from the top of the thimble, and a retracted position, wherein the scraper extends beyond the top of the thimble.
Also, in a preferred embodiment, the thimble defines a bottom and further includes at least one support rod attached to the scraper. The support rod extends through the bottom of the thimble and supports the scraper as the thimble moves relative to the scraper between the extended position and the retracted position. Preferably, the thimble assembly includes at least one support rod sleeve that is disposed around the support rod and at least one spring that is disposed around the support rod between the support rod sleeve and the thimble, the spring biasing the thimble toward the extended position.
A preferred embodiment of the present invention also includes at least one adjusting mechanism to adjust the height of the scraper relative to the thimble. Additionally, in a preferred embodiment, the thimble assembly includes a solder pot having a top and the thimble is movable between a partially submerged configuration, wherein the thimble is in the extended position and the thimble protrudes at least partially beyond the top of the solder pot, and a fully submerged configuration, wherein the thimble is in the retracted position and the thimble is disposed within the solder pot.
In another aspect of the present invention, a soldering apparatus includes a solder pot that defines a top, and a thimble is reciprocably disposed within the solder pot. The thimble defines a top and a scraper is disposed within the thimble. In this aspect of the present invention, the thimble is movable between an extended position, wherein the scraper is distanced from the top of the thimble, and a retracted position, wherein the scraper extends beyond the top of the thimble to scrape dross therefrom.
In yet another aspect of the present invention, a method for joining two electrical conductors with molten solder includes submerging a thimble in a solder pot filled with molten solder, at least partially removing the thimble from the solder pot, exposing at least two wires to molten solder within the thimble, and scraping dross off the thimble as the thimble is submerged in the solder pot.
The present invention will now be described, by way of example, with reference to the accompanying drawings, in which:
REFERENCES:
patent: 4509670 (1985-04-01), Cammarata
patent: 4666077 (1987-05-01), Rahn et al.
patent: 5087356 (1992-02-01), Webb
patent: 5192014 (1993-03-01), Ciniglio et al.
patent: 5330801 (1994-07-01), Monteiro et al.
patent: 5845839 (1998-12-01), Dodge et al.
patent: 6004507 (1999-12-01), Morando
Avila Miguel I.
Vazquez Oscar
Delphi Technologies Inc.
Dobrowitsky Margaret A.
Dunn Tom
Edmondson L.
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