Self cleaning liquid solder flux

Metal treatment – Compositions – Fluxing

Patent

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Details

148 25, B23K 3534

Patent

active

047387327

ABSTRACT:
A soldering flux, method for fluxing pieces, and method for joining pieces, wherein hydrofluoric acid or an evaporative organic acid is mixed with an evaporative organic solvent to form the flux. Neither precleaning nor postcleaning of the pieces being joined is necessary. The flux evaporates completely upon heating, leaving no corrosive residue or other product on the surface of the piece. The portion of the piece to be bonded is dipped into the flux and immediately tinned, before soldering.

REFERENCES:
patent: 3748191 (1973-07-01), Strauss
patent: 4360392 (1982-11-01), Roberts

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