Self-centering electrode for power devices

Details Self-centering electrode for power devices Self-centering electrode for power devices

1988-09-09

1990-06-19

Jackson, Jr., Jerome

357 69, 357 70, H01L 2348, H01L 2944

Patent

active

049358030

ABSTRACT:
An improved means and method for forming leads to a power device is provided by use of a one-piece leadframe on which the die is mounted and a separate connecting clip between the leadframe and the bonding pad on the semiconductor die. The leadframe has an alignment dimple or groove for receiving a mating alignment feature on one end of the connecting clip. The other end of the connecting clip is located over the bonding pad on the die. Solder is placed between die and the leadframe and between the connecting clip and the bonding pad and between the mating alignment surfaces on the clip and leadframe. When the solder is liquid during assembly the die and clip float thereon and automatically align by surface tension so that the die is centrally located on the die flag, the connection point on the clup is centered on the bonding pad and the mating alignment surfaces on the clip and leadframe are engaged. The self-aligning process is dominated by the mating alignment regions on the connecting clip and leadframe which have a larger area and solder wetted periphery than the other regions being soldered.

REFERENCES:
patent: 3290564 (1966-12-01), Wolff, Jr.
patent: 3365620 (1968-01-01), Butler et al.
patent: 3374533 (1968-03-01), Burks et al.
patent: 3478420 (1968-12-01), Grimes et al.
patent: 3500136 (1968-01-01), Fischer
patent: 3569797 (1971-03-01), Simmons
patent: 3763403 (1972-03-01), Lootens
patent: 3869787 (1975-03-01), Umbaugh
patent: 3997963 (1976-12-01), Riseman
patent: 4012765 (1975-09-01), Lehner et al.
patent: 4117508 (1978-09-01), Koenig
patent: 4158745 (1979-06-01), Keller
patent: 4252864 (1981-02-01), Coldren
patent: 4346396 (1982-08-01), Carroll, II et al.
IBM TDB, Hayunga et al., vol. 9, No. 11, Apr. 1967, p. 1653, "Serrated . . . Chip Devices".

Affiliated with

Also associated with

Rating

Self-centering electrode for power devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Self-centering electrode for power devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Self-centering electrode for power devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2263577