Fishing – trapping – and vermin destroying
Patent
1990-02-09
1991-02-19
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437209, H01L 2348, H01L 2944
Patent
active
049944126
ABSTRACT:
An improved means and method for forming leads to a power device is provided by use of a one-piece leadframe on which the die is mounted and a separate connecting clip between the leadframe and the bonding pad on the semiconductor die. The leadframe has an alignment dimple or groove for receiving a mating alignment feature on one end of the connecting clip. The other end of the connecting clip is located over the bonding pad on the die. Solder is placed between die and the leadframe and between the connecting clip and the bonding pad and between the mating alignment surfaces on the clip and leadframe. When the solder is liquid during assembly the die and clip float thereon and automatically align by surface tension so that the die is centrally located on the die flag, the connection point on the clip is centered on the bonding pad and the mating alignment surfaces on the clip and leadframe are engaged. The self-aligning process is dominated by the mating alignment regions on the connecting clip and leadframe which have a larger area and solder wetted periphery than the other regions being soldered.
REFERENCES:
patent: 2352640 (1944-07-01), Kotterman
patent: 3869787 (1975-03-01), Umbaugh
patent: 4633582 (1987-01-01), Ching et al.
patent: 4754316 (1988-06-01), Reid
Gooch Robert A.
Kalfus Martin
Chaudhuri Olik
Griffis Andrew
Handy Robert M.
Motorola Inc.
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