Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2005-09-29
2008-09-02
Dinh, Phuong K (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07419383
ABSTRACT:
An embodiment of the present invention is a Land Grid Array (LGA) socket. A first L-shaped area has a first center, a first outer long side, and a first outer short side. The first L-shaped area contains a first set of contacts oriented in a first direction. A second L-shaped area has a second center, a second outer long side, and a second outer short side and is located symmetrically to the first L-shaped area. The second L-shaped area contains a second set of contacts oriented in a second direction opposite to the first direction such that pressing a device on the first and second sets of contacts results in approximately zero force and moment.
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Brown, D.D., et al., “An Adaptable, High Performance LGA Connector Technology”, HCD, Inc., Sunnyvale, CA 94089.
Corbin, J.S., et al., “Land Grid Array Sockets for Server Applications”, IBM J. Res. & Dev., vol. 46, No. 6, pp. 763-778 Nov. 2002.
Blakely , Sokoloff, Taylor & Zafman LLP
Dinh Phuong K
Intel Corporation
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