Self-assembly of elements using microfluidic traps

Metal fusion bonding – Process – Plural diverse bonding

Reexamination Certificate

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Details

C438S022000, C438S107000, C438S110000, C257S622000, C257S723000

Reexamination Certificate

active

07874474

ABSTRACT:
A self-assembly process is disclosed for integrating free standing microcomponents onto a template having a plurality of binding sites, an interconnect network, and trapping structures disposed downstream of the binding sites. The self-assembly is accomplished by flowing a fluid medium containing the microcomponents over the template such that some of the microcomponents are trapped at binding sites. The template may be simultaneously (or subsequently) heated to melt a binder such as a solder spot at each of the binding sites, and then cooled to connect the trapped microcomponents to the interconnect network. In one embodiment, removable blocking elements are disposed upstream of some of the binding sites, for example formed from photoresist. After assembling a first set of microcomponents, the blocking elements are removed, and a second set of microcomponents in a fluid medium are flowed over the template for assembly into the newly unblocked binding sites.

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Boehringer, K.F., et al., “Modeling of Capillary Forces and Binding Sites for Fluidic Self-Assembly,” Proceedings of the 14th IEEE International Conference on Micro Electro Mechanical Systems [MEMS 2001], Interlaken, Switzerland, Jan. 21-25, 2001, pp. 369-374.

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