Self-assembled molecular films incorporating a ligand

Details Self-assembled molecular films incorporating a ligand Self-assembled molecular films incorporating a ligand

1993-10-29

1996-04-23

Robinson, Douglas W.

Organic compounds -- part of the class 532-570 series

Organic compounds

Carbohydrates or derivatives

536 111, 536 41, 536 184, 536 185, 536 186, 536122, 10628712, 10628713, 428447, 428448, C07H 1504, C07H 1500, C07H 2300, B32B 904

Patent

active

055104819

ABSTRACT:
Functionalized monomers are presented which can be used in the fabrication of molecular films for controlling adhesion, detection of receptor-ligand binding and enzymatic reactions; new coatings for lithography; and for semiconductor materials. The monomers are a combination of a ligand, a linker, optionally including a polymerizable group, and a surface attachment group. The processes and an apparatus for making films from these monomers, as well as methods of using the films are also provided.

REFERENCES:
patent: 3983299 (1976-09-01), Regnier
patent: 4702773 (1987-10-01), Ashlock et al.
patent: 4704416 (1987-11-01), Eck et al.
patent: 4859538 (1989-08-01), Ribi
patent: 4871837 (1989-10-01), Magnusson et al.
patent: 5051129 (1991-09-01), Cuthbert et al.
patent: 5112393 (1992-05-01), Engel et al.
patent: 5156810 (1992-10-01), Ribi
patent: 5219652 (1993-06-01), Shimaski
Koontz et al. U.S. patent application Ser. No. 07/857,901.
Matsandrea et al. J. Mat. Ed. vol. 11 pp. 529-564, (1989).
Matsandrea et al. Mat. Res. Soc. Symp. Proc. vol. 174, pp. 277-288, (1990).

Affiliated with

Also associated with

Rating

Self-assembled molecular films incorporating a ligand does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Self-assembled molecular films incorporating a ligand, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Self-assembled molecular films incorporating a ligand will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2309584