Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2007-08-21
2007-08-21
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C438S022000, C438S048000
Reexamination Certificate
active
11052875
ABSTRACT:
The present invention discloses a self-alignment manufacturing method of a microlens and an aperture using in an optical device. The method manufactures the aperture and the circular opening in the opaque film on a transparent substrate, and utilizes the self-alignment backside exposure technology to precisely integrate the aperture and the microlens made by macromolecule material without any combination step. The claimed method is simpler than conventional technology and can precisely align and integrate the microlens and the aperture with a continuous batch manufacture. Since the aperture and the circular opening are concentric circles and formed in same step, the microlens and the aperture can be precisely aligned with the backside exposure. The claimed invention can effectively improve the optical resolution and efficiency of the optical access and measurement devices.
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patent: 6335522 (2002-01-01), Shimada et al.
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patent: 6721262 (2004-04-01), Jordache et al.
Chang Yu-Ru
Chiu Yi
Hsu Wen Syang
Le Dung A.
National Chiao Tung University
Rosenberg , Klein & Lee
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