Heat exchange – With retainer for removable article – Electrical component
Patent
1987-10-13
1988-12-20
Yeung, James C.
Heat exchange
With retainer for removable article
Electrical component
165 46, 361385, F28F 700
Patent
active
047919833
ABSTRACT:
An assembly for cooling an array of IC packages which have respective non-coplanar heat dissipating surfaces, comprises: a frame that is attachable to the array and has multiple beams, each of which is positioned to overlie some of the IC packages; respective liquid-cooling jackets for the IC packages with each jacket having a heat absorbing face; each jacket being mounted via a post that is loosely fitted through a respective hole in one of the beams in proximity with a respective one of the IC packages; and each jacket mounting providing a flexible connection which allows the jacket's heat absorbing face to be placed at multiple angles and different heights, and thereby coincide with the non-coplanar heat dissipating surface of an IC package.
REFERENCES:
patent: 4093971 (1978-06-01), Chu et al.
patent: 4109707 (1978-08-01), Wilson et al.
patent: 4193445 (1980-03-01), Chu et al.
patent: 4448240 (1984-05-01), Sharon
patent: 4671204 (1987-06-01), Ballou
Module Board Service Frame, Cannistra et al., IBM Technical Disclosure Bulletin, vol. 20, No. 2, Jul. 1979.
Adrian George J.
Nicol Edward A.
Fassbender Charles J.
Marhoefer L. Joseph
Unisys Corporation
Yeung James C.
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