Self-aligning bonding technique

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

51283R, 156154, 428149, B32B 3112

Patent

active

047986433

ABSTRACT:
A method of providing uniform application of pressure during thermocompression bonding of semiconductor elements onto a bonding surface of a semiconductor package is described. A member having a plane surface is interposed between the semiconductor element and the bonding tool to provide a uniform force distribution to the plane surface of the member and hence to the semiconductor elements. In a preferred embodiment, a plano-convex vitreous member is placed upon the top of the semiconductor element with the plane surface thereof contacting the semiconductor element. A bonding tool is brought into contact with the convex surface portion of the hemisphere transmitting a uniform force to the plane surface, Thus, uniform force is brought to bear upon the semiconductor element providing a uniform thermocompression bond between the semiconductor element and the bonding surface. The plano-convex members are provided by placing members having at least one curved surface, for example, spheres in an abradible securing medium and abrading an exposed area of said spheres and the medium until a predetermined plane surface is provided. The resulting plano-convex members are then freed from the medium and recovered.

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patent: 3194702 (1965-07-01), Geller et al.
patent: 3963551 (1976-06-01), Marlinski
patent: 4082213 (1978-04-01), Rangabe
patent: 4106915 (1978-08-01), Kagawa et al.
patent: 4384431 (1983-05-01), Jackson
patent: 4388132 (1983-06-01), Hoge et al.

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