Self-aligned void filling for mushroomed plating

Details Self-aligned void filling for mushroomed plating Self-aligned void filling for mushroomed plating

2006-10-17

2006-10-17

Chen, Tianjie (Department: 2627)

Dynamic magnetic information storage or retrieval

Head

Core

Reexamination Certificate

active

07123443

ABSTRACT:
The present invention includes an overplated component which includes an enlarged mushroom head having outer portions which overhang a hard baked resist layer. The device is ultimately encapsulated such that no voids and/or redeposition problems exist under the overhang due to the presence of the hard baked resist. While not intended to be limiting in any manner, a device of the present invention is a thin film magnetic head wherein the yoke portion of a magnetic pole is formed utilizing the mushroom plating techniques of the present invention. Another mushroom plated component found in many devices is a mushroom plated electrical interconnecting stud that is formed utilizing the process steps of the present invention.

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