Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1990-12-26
1993-05-18
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174262, H05K 100
Patent
active
052123529
ABSTRACT:
Via patterns (16, 18) are applied to a first interlevel oxide layer (58) down to a metal layer (52) to define a plurality of orifices. These orifices (61, 63) are filled with tungsten by selective chemical vapor deposition. A first level conductor pattern (10, 12, 14) is then used to etch away the first insulator layer (58) and portions of plugs (62, 64) that are outside the first level conductor pattern. This first level conductor pattern is also used for a subsequent first level metal etch. The entire structure is then covered with a self-planarizing oxide layer (82), which is subsequently etched back to expose the top surfaces (66, 68) of tungsten plugs (62, 64).
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Brighton Jeffrey E.
Verret Douglas P.
Barndt B. Peter
Brady III W. James
Donaldson Richard L.
Korka Trinidad
Picard Leo P.
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