Self-aligned stacked gate EPROM cell using tantalum oxide contro

Fishing – trapping – and vermin destroying

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437 48, 257315, H01L 27115, H01L 21265

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active

053045033

ABSTRACT:
A process flow for fabricating a self-aligned stacked gate EPROM cell that uses a CVD tantalum oxide film to replace ONO as a control gate dielectric. Tungsten replaces polysilicon as the control gate. Both the dielectric deposition and cell definition steps of the process flow are performed in a back-end module to improve dielectric integrity in the memory cells by minimizing high temperature exposure of the tantalum oxide film.

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