Self-aligned sputter deposition masking device and method

Details Self-aligned sputter deposition masking device and method Self-aligned sputter deposition masking device and method

1992-04-24

1993-12-07

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429815, C23C 1434

Patent

active

052680851

ABSTRACT:
The present invention is a device and method for masking a predetermined area on a surface during sputter deposition. The present invention includes a plurality of alignment arms that extend above the surface to be sputter coated and terminate above the periphery of the area to be masked. A masking member is formed to have a profile that exactly matches the area to be masked. The alignment arms prevent the masking member from contacting the surface to be sputter coated until the masking member is properly oriented and aligned above the area to be masked. The masking member then passes through the alignment arms, masking the desired area, while the alignment arms prevent the masking member from moving away from the desired masked area.

REFERENCES:
patent: 3897324 (1975-07-01), Del Monte et al.
patent: 4013533 (1977-03-01), Cohen-Solal et al.
patent: 4473455 (1984-09-01), Dean et al.
patent: 4745878 (1988-05-01), Sagawa

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