Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of...
Reexamination Certificate
2005-03-22
2005-03-22
Lee, Eddie (Department: 2811)
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
C438S320000, C438S361000, C438S364000, C438S359000, C257S565000, C257S586000
Reexamination Certificate
active
06869852
ABSTRACT:
A method of fabricating a bipolar transistor structure that provides unit current gain frequency (fT) and maximum oscillation frequency (fMAX) improvements of a raised extrinsic base using non-self-aligned techniques to establish a self-aligned structure. Accordingly, the invention eliminates the complexity and cost of current self-aligned raised extrinsic base processes. The invention forms a raised extrinsic base and an emitter opening over a landing pad, i.e., etch stop layer, then replaces the landing pad with a conductor that is converted, in part, to an insulator. An emitter is then formed in the emitter opening once the insulator is removed from the emitter opening. An unconverted portion of the conductor provides a conductive base link and a remaining portion of the insulator under a spacer isolates the extrinsic base from the emitter while maintaining self-alignment of the emitter to the extrinsic base. The invention also includes the resulting bipolar transistor structure.
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“A Selective-Epitaxial-Growth SiGe-Base HBT With SMI Electrodes Feraturing 9.3-ps ECL-Gate Delay,” K. Washio et al., IEEE Transactions on Electron Devices, vol. 46, No. 7, Jul. 1999, pp. 1411-1416.
Joseph Alvin J.
Liu Qizhi
Rainey BethAnn
Schonenberg Kathryn T.
Canale Anthony J.
Gebremariam Samuel A
Hoffman Warnick & D'Alessandro LLC
International Business Machines - Corporation
Lee Eddie
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