Self-aligned nonnested sloped via

Details Self-aligned nonnested sloped via Self-aligned nonnested sloped via

1989-05-08

1990-06-05

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

430314, 430317, 430330, 427228, 427229, H05K 100

Patent

active

049311441

ABSTRACT:
A via (64, 66, 68) comprises a conductor (45, 46, 48) having a first surface (58, 60, 62) and at least one second surface (49) that forms at least one edge (52) with the first surface (58, 60, 62). A first insulator layer (33) is formed on the first surface and defines a first area (58, 60, 62) on the conductor that is not covered by the first insulator layer (33). A second insulator layer (70) is formed over the second surface (49). The first and second insulator layers (33, 70) define a via (64, 66 and 68) to the conductor (45, 46, 48). The bottom area (58, 60, 62) of the via (64, 66, 68) is equal to the first area and is bounded in part by the edge (52).

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patent: 4628149 (1986-12-01), Dohya
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