Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1984-09-28
1986-10-28
Roy, Upendra
Metal working
Method of mechanical manufacture
Assembling or joining
29576B, 29576T, 148 15, 148187, 148DIG10, 357 34, 357 91, 427 531, H01L 21265, H01L 21322
Patent
active
046190368
ABSTRACT:
After the extrinsic base region of a bipolar transistor has been formed, and the emitter contact has been patterned and cut, the emitter dopant is deposited or spun on, and the emitter dopant is then driven in using a short pulse of radiant energy. The necessity for high-temperature annealing of the emitter doping is thereby avoided, and the base doping profile is not disturbed by high-temperature annealing steps.
REFERENCES:
patent: 4338139 (1982-07-01), Shinada
patent: 4377031 (1983-03-01), Goto et al.
patent: 4377421 (1983-03-01), Wada et al.
patent: 4377902 (1983-03-01), Shinada et al.
Joshi et al., IBM--TDB, 13, (1970), 928.
Anantha et al., IBM--TDB, 22, (1979), 575.
Hendel et al., Jour. Vac. Sci. Technol., 18, (1981), 818.
Tsunoda, Jap. Jour. Appl. Phys., 21, (1982), L-106.
Baber Samuel C.
Havemann Robert H.
Comfort James T.
Groover III Robert
Roy Upendra
Sharp Melvin
Texas Instruments Incorporated
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