Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...
Reexamination Certificate
2007-06-12
2007-06-12
Vu, Hung (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Non-single crystal, or recrystallized, semiconductor...
Field effect device in non-single crystal, or...
C257S069000, C257S347000, C257S350000
Reexamination Certificate
active
10997446
ABSTRACT:
In a method of forming a double gate device, a buried insulating layer having a thickness of less than about 30 nm is formed on a first substrate. A second substrate is formed on the buried insulating layer. A pad layer is formed over the second substrate. A mask layer is formed over the pad layer. A first trench is formed extending through the pad layer, second substrate, buried insulating layer and into the first substrate. The first trench is filled with a first isolation. A second trench is formed in the first isolation and filled with a conductive material. An MOS transistor is formed on the second substrate. A bottom gate is formed under the buried insulating layer and self-aligned to the top gate formed on the second substrate.
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Chen Hao-Yu
Hsu Ju-Wang
Perng Baw-Ching
Yang Fu-Liang
Slater & Matsil L.L.P.
Taiwan Semiconductor Manfacturing Company, Ltd.
Vu Hung
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