Self-aligned contact technology

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 36, 357 59, H01L 2128, H01L 2970, H01L 2348

Patent

active

049928481

ABSTRACT:
A new self-aligned contact technology is afforded by semiconductor devices having a digitated electrode and a contiguous conductive region that contact first semiconductor regions and second semiconductor regions, respectively. The first semiconductor regions and the second semiconductor regions are formed in a semiconductor substrate, with each second semiconductor region underlying a finger of the digitated electrode. Advantageously, by forming a contiguous conductive region over the first semiconductor regions located between the fingers of the digitated electrode, it is not only possible to contact second semiconductor regions with a common electrode, but also to self-align the common electrode with the digitated electrode. Ohmic shorting between the digitated electrode and the contiguous conductive region is afforded by interposing an insulating region therebetween. Furthermore, with a single common electrode contacting the second semiconductor regions, it is possible, among other things, to effectively reduce the parasitic capacitances of the semiconductor device as well as achieve dimensional scaling since ohmic contact to the conductive region can be made outside the fingers where physical dimensions are of no limitation.

REFERENCES:
patent: 4319932 (1982-03-01), Jambotkar
patent: 4453306 (1984-06-01), Lynch et al.
patent: 4521952 (1985-06-01), Riseman
patent: 4729965 (1988-03-01), Tamaki et al.
patent: 4748490 (1988-05-01), Hollingsworth
patent: 4824796 (1989-04-01), Chiu et al.
"Emitter Metallization in Multiemitter Transistors"--Dahmen et al., IBM Technical Disclosure, vol. 18, No. 7, Dec. 1975, p. 2186.
"Power Transistor Having Increased Reverse Bias Safe Operating Area"--Hilett--IBM Technical Disclosure Bulletin, vol. 16, No. 11, Apr. 1974.
H. Nakashiba et al., "An Advanced PSA Technology for High-Speed Bipolar LSI", IEEE Transactions on Electron Devices, vol. ED-27, No. 8, Aug. 1980, pp. 1390-1394.
T. Sakai et al., "Super Self-Aligned Bipolar Technology", Symposium on VLSI Technology, Tech. Digest, pp. 16-19, 1983.
T. H. Ning et al., "Self-Aligned Bipolar Transistors for High-Performance and Low-Power-Delay VLSI", IEEE Transactions on Electron Devices, vol. ED-28, No. 9, Sep. 1981, pp. 1010-1013.
A. Cuthbertson et al., "Self-Aligned Transistors with Polysilicon Emitters for Bipolar VLSI", IEEE Transactions on Electron Devices, vol. ED-32, No. 2, Feb. 1985, pp. 242-247.
S. H. Chai et al., "A New Self-Aligned Bipolar Transistor Using Vertical Nitride Mask", IEDM Tech. Digest, pp. 26-29, 1985.
J. L. de Jong et al., "Electron Recombination at the Silicided Base Contact of an Advanced Self-Aligned Poly-Silicon Emitter", IEEE 1988 Bipolar Circuits & Technology Meeting, 1988, pp. 202-205.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Self-aligned contact technology does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Self-aligned contact technology, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Self-aligned contact technology will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-24233

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.