Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Forming base region of specified dopant concentration profile
Reexamination Certificate
2006-06-20
2006-06-20
Vu, David (Department: 2818)
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
Forming base region of specified dopant concentration profile
C257S565000
Reexamination Certificate
active
07064042
ABSTRACT:
The invention relates to a process of forming a bipolar junction transistor (BJT) that includes forming a topology over a substrate. Thereafter, a spacer is formed at the topology. A base layer is formed from epitaxial silicon above the spacer and at the topology. A leakage block structure is formed in the substrate by out-diffusion from the spacer. Thereafter a BJT is completed with the base layer and the spacer.
REFERENCES:
patent: 4142117 (1979-02-01), Chang
patent: 4330569 (1982-05-01), Gulett et al.
patent: 4830972 (1989-05-01), Hamasaki
patent: 5137840 (1992-08-01), Desilets et al.
patent: 5323032 (1994-06-01), Sato et al.
patent: 5523245 (1996-06-01), Imai
patent: 5837929 (1998-11-01), Adelman
patent: 2001/0048134 (2001-12-01), Park
Ahmed Shahriar
Bohr Mark
Chambers Stephen
Green Richard
Murthy Anand
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Vu David
LandOfFree
Self aligned compact bipolar junction transistor layout, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Self aligned compact bipolar junction transistor layout, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Self aligned compact bipolar junction transistor layout, and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3649151