Self-aligned bump bond infrared focal plane array architecture

Details Self-aligned bump bond infrared focal plane array architecture Self-aligned bump bond infrared focal plane array architecture

1995-05-08

1996-07-16

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437 3, 437134, 437137, 437202, H01L 2144

Patent

active

055366805

ABSTRACT:
A method of making a diode and the diode wherein there is provided a substrate of p-type group II-VI semiconductor material and an electrically conductive material capable of forming an ohmic contact with the substrate is forced into the lattice of the substrate to create an n-type region in the substrate in contact with the material and forming an electrical contact to the p-type region of said substrate. The substrate is preferably HgCdTe and the electrically conductive material is preferably tungsten or tin coated tungsten or tungsten coated with a mercury amalgam. Also a method of making an infrared focal plane array and the array wherein there is provided a semiconductor integrated circuit having electrically conductive pads on a surface thereof, forming bumps of an electrically conductive material on predetermined ones of the pads, providing a substrate of p-type group II-VI semiconductor material, disposing a layer of bonding material over one of the surface of the integrated circuit containing the pads or a surface of the substrate, forcing the bumps into the lattice of the substrate to create an n-type region in the substrate in contact with the material, bonding the substrate to the integrated circuit and forming an electrical connection between the p-type region of the substrate and one of the pads. The process is otherwise the same as the diode fabrication.

REFERENCES:
patent: 4521798 (1985-06-01), Baker
patent: 4956304 (1990-09-01), Cockrum et al.
patent: 5034794 (1991-07-01), Murotani
patent: 5144138 (1992-09-01), Kinch et al.
patent: 5146297 (1992-09-01), Collins et al.
patent: 5188970 (1993-02-01), York et al.
patent: 5285098 (1994-02-01), Borrello
patent: 5298733 (1994-03-01), Ehmke et al.
patent: 5329112 (1994-07-01), Mihara
patent: 5370301 (1994-12-01), Belcher et al.
patent: 5412242 (1995-05-01), Cahen et al.

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