Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2007-06-26
2007-06-26
Aftergut, Jeff H. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C029S825000, C029S829000, C029S830000, C029S831000, C174S250000, C216S034000, C216S035000
Reexamination Certificate
active
10616341
ABSTRACT:
A printed wiring board is formed from two or more layers, one of which has circuit lines formed thereon, and wherein the surfaces of the circuit lines are roughened only in areas that require good copper to laminate adhesion. The remainder of the circuit line surfaces are smooth. Thus, those areas for propagation of the signal on signal lines have the circuit lines smooth to maximize the signal propagation effect, while those areas where the signal propagation is not critical are rough, which improves the adhesion of one layer to another. On the voltage planes, the surface in those regions opposite the smooth surfaces of the signal planes is smooth. Thus, these areas of the voltage planes can be maintained smooth while the other areas of the surface of the voltage planes can be roughened, providing good adhesion to the adjoining dielectric material.
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Day Richard Allen
Knadle Kevin Taylor
Stauffer Kristen Ann
Aftergut Jeff H.
Hogg William N.
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