Selectively programmable interconnections in multilayer integrat

Details Selectively programmable interconnections in multilayer integrat Selectively programmable interconnections in multilayer integrat

1989-06-26

1992-02-11

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437189, 437199, 437196, 437 24, 437173, H01L 2144

Patent

active

050875892

ABSTRACT:
A method of fabricating programmable interlayer conductive links in a multilayer integrated circuit structure, comprising the steps of forming elements of either a conductive or semiconductive material as a lower layer, depositing an insulative layer on top of the lower layer elements, implanting ions into one or more link regions of the insulative layer, forming at least one upper conductor over the implanted regions and selectively applying sufficient energy to at least one of the implanted regions of the integrated circuit structure to render the selected link region conductive. The invention also embraces customized integrated circuit structures with interlayer conductive paths made in accordance with this method.

REFERENCES:
patent: 4137100 (1979-01-01), Zaleckas
patent: 4662063 (1987-05-01), Collins et al.
patent: 4810663 (1989-03-01), Raffel et al.
patent: 4840923 (1989-07-01), Flagello et al.
patent: 4843034 (1989-06-01), Herndon et al.
patent: 4907066 (1990-03-01), Thomas et al.

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