Selectively filled adhesives for semiconductor chip interconnect

Details Selectively filled adhesives for semiconductor chip interconnect Selectively filled adhesives for semiconductor chip interconnect

1996-07-12

1998-09-29

Abrams, Neil

Electrical connectors

Including elastomeric or nonmetallic conductive portion

Adapted to be sandwiched between preformed panel circuit...

H01R 458

Patent

active

058138706

ABSTRACT:
Dielectric adhesive film patterned with clusters of electrically conductive filaments that extend through the film thickness for providing electrical interconnection and encapsulation. The dielectric adhesive material is reworkable. The clusters are formed by selectively electroplating a noble metal at a high current density.

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