Selectively filled adhesive film containing a fluxing agent

Details Selectively filled adhesive film containing a fluxing agent Selectively filled adhesive film containing a fluxing agent

1997-02-04

1998-09-29

Davis, Jenna

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

174260, 361743, 361807, 428335R, 428355EP, C09J 702

Patent

active

058144013

ABSTRACT:
A selectively filled thermally curable adhesive film (10) contains a fluxing agent for reflow soldering an electronic device to a substrate. The adhesive film has a central, region (12) and a boundary region (14) surrounding the central region. The central region consists of an adhesive that is filled with an inert filler to reduce the co-efficient of thermal expansion of the adhesive. The boundary region consists of an unfilled adhesive and a fluxing agent. The film may be used to adhesively bond a flip chip semiconductor die (20) to a substrate (21). When solder bumps (22) on the die are reflowed, the fluxing agent acts to remove any oxides present on the solderable surfaces of the substrate or the die.

REFERENCES:
patent: 5128746 (1992-07-01), Pennisi et al.
patent: 5136365 (1992-08-01), Pennisi et al.
patent: 5293067 (1994-03-01), Thompson et al.
patent: 5473512 (1995-12-01), Degani et al.

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