Selectively electrolessly depositing a metal pattern on the surf

Details Selectively electrolessly depositing a metal pattern on the surf Selectively electrolessly depositing a metal pattern on the surf

1979-03-12

1981-04-28

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427108, 427259, 427282, 427287, 427304, 427305, 427306, 430315, C23C 302

Patent

active

042646464

ABSTRACT:
The method of selectively depositing a metal pattern on the surface of a laminar film comprising a dielectric substrate having a co-extensive metallic layer and a ceramic overlayer. A desired metallic pattern may be formed on the surface of the film by applying a releaseable mask in those regions of the film surface where plating of the surface is not desired, catalyzing the unmasked regions of the film surface, removing the mask from the film surface and thereafter immersing the film in an electroless plating bath whereby only the catalyzed regions are plated with the electroless metal of the bath. The preferred film has gold intermediate layer upon which electroless nickel or copper pattern plating is accomplished.

REFERENCES:
patent: 3485665 (1969-12-01), De Angelo et al.
patent: 3671311 (1972-06-01), Tarnopol et al.
patent: 3694250 (1972-09-01), Grunwald et al.
patent: 3772075 (1973-11-01), Tarnopol et al.
patent: 3873360 (1975-03-01), Lando
patent: 3877981 (1975-04-01), Arnold
patent: 4016307 (1977-04-01), Collaris et al.
patent: 4029942 (1977-06-01), Levin
Feldstein, "Selective Electroless Plating Techniques: A Survey" Plating, Aug. 1970.

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