Selectively coating bond pads

Details Selectively coating bond pads Selectively coating bond pads

2006-02-14

2006-02-14

Thomas, Tom (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S769000, C257S775000

Reexamination Certificate

active

06998714

ABSTRACT:
Solder ball bond pads and wire bond pads may be selectively coated so that the wire bond bond pads have a thicker gold coating than the solder ball bond pads. This may reduce the embrittlement of solder ball joints while providing a sufficient thickness of gold for the wire bonding process. In general, gold coatings are desirable on electrical contact surfaces to prevent oxidation. However, the thickness of gold which is necessary on solder ball bond pads may be less and excessive gold may be disadvantageous. Thus, by masking the solder ball bond pads during the gold coating of the wire bond bond pads, a differential gold thickness may be achieved which is more advantageous for each application.

REFERENCES:
patent: 5380679 (1995-01-01), Kano
patent: 5625734 (1997-04-01), Thomas et al.
patent: 5693565 (1997-12-01), Camilletti et al.
patent: 5909633 (1999-06-01), Haji et al.
patent: 05315731 (1993-11-01), None
patent: H10-163241 (1998-06-01), None
patent: 11067957 (1999-03-01), None
patent: H11-67957 (1999-03-01), None

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