Selective wiring for multilayer printed circuit board

Details Selective wiring for multilayer printed circuit board Selective wiring for multilayer printed circuit board

1982-10-22

1985-01-22

Gensler, Paul

Wave transmission lines and networks

Long lines

Strip type

174 685, 29829, 361414, H01P 318

Patent

active

044954794

ABSTRACT:
Multilayer printed circuit boards are designed and produced using a selective wiring technique which segregates short, medium length and long lines. By placing short medium length and long lines on different layers, line specifications can be relaxed for the layers with shorter lines. This relaxation of specifications allows for the effective use of subtractive, additive and encapsulated wire manufacturing techniques in the production of complex multilayer printed circuit boards. Each layer of segregated line lengths is fabricated in accordance with the appropriate technique for a given line length to obtain a multilayer printed circuit board optimized for cost and/or performance and reliability.

REFERENCES:
patent: 3541223 (1970-11-01), Helms
patent: 3674914 (1972-07-01), Burr
patent: 3691563 (1972-09-01), Shelton
patent: 4030190 (1977-06-01), Varker
patent: 4097684 (1978-06-01), Burr
patent: 4127438 (1978-11-01), Babcock et al.
patent: 4328531 (1982-05-01), Nagashima et al.

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