Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Reexamination Certificate
2007-05-08
2007-05-08
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
C228S010000, C228S037000
Reexamination Certificate
active
10260980
ABSTRACT:
The present invention relates to a selective wave solder machine. In particular, it relates to a system for calibrating and adjusting process points to account for variations in machines and circuit boards. Vision systems are used to locate fiducials on the processing modules and the circuit boards. Differences between stored locations for fiducials relating to the circuit board and the processing modules are used to adjust the positions of stored process points to achieve improved performance.
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International Search Reported mailed Mar. 26, 2003, PCT/US03/30954, Speedline Technologies, Inc.
Beard Troy
Howell Keith
Ludwig Eric
Johnson Jonathan
Lowrie Lando & Anastasi, LLP
Speedline Technologies, Inc.
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