Selective wave solder system

Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...

Reexamination Certificate

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Details

C228S010000, C228S037000

Reexamination Certificate

active

10260980

ABSTRACT:
The present invention relates to a selective wave solder machine. In particular, it relates to a system for calibrating and adjusting process points to account for variations in machines and circuit boards. Vision systems are used to locate fiducials on the processing modules and the circuit boards. Differences between stored locations for fiducials relating to the circuit board and the processing modules are used to adjust the positions of stored process points to achieve improved performance.

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International Search Reported mailed Mar. 26, 2003, PCT/US03/30954, Speedline Technologies, Inc.

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