Selective wave solder apparatus

Details Selective wave solder apparatus Selective wave solder apparatus

1991-12-23

1992-09-22

Seidel, Richard K.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228260, B23K 108

Patent

active

051489619

ABSTRACT:
The selective wave soldering apparatus (101) of the present invention permits wave soldering of select components on a printed circuit board. This is accomplished by narrowing the flow of solder from the wave solder apparatus and creating the proper back pressure on two sides of the flow to form the proper height wave. The back pressure is created by an extended, angled lip (102) on one side and a trough (103) on the side opposite the lip. The trough (103) is open on top and has small openings in one end to slow the flow of molten solder from the trough (103).

REFERENCES:
patent: 4682723 (1987-07-01), Grummet
patent: 4848640 (1989-07-01), Gieskes
Air-Vac brochure for a wave solder module.
Air-Vac brochure for an apparatus for soldering and desoldering, 1987.

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