Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate
2003-07-31
2008-07-15
Vinh, Lan (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
C438S750000, C134S001200, C156S345110
Reexamination Certificate
active
07399713
ABSTRACT:
This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides or the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece as the workpiece and corresponding reactor are spinning about an axis of rotation that is generally orthogonal to the center of the face of the workpiece being processed. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.
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Aegerter Brian K.
Curtis Gary L.
Dundas Curt T.
Jolley Michael
Peace Steven L.
Klarquist & Sparkman, LLP
Semitool Inc.
Vinh Lan
LandOfFree
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