Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Reexamination Certificate
2011-03-29
2011-03-29
Ward, Jessica L (Department: 1735)
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
C228S033000, C228S040000, C228S043000, C228S047100, C228S056100, C228S180100
Reexamination Certificate
active
07913894
ABSTRACT:
A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of its edges to provide a second degree of freedom of motion to the top flat carrier in dipping the PWBs relative to the solder bath, thereby providing a solder machine with a relatively small footprint that nonetheless can achieve precise soldering of PWBs.
REFERENCES:
patent: 4512510 (1985-04-01), Kondo
patent: 7631796 (2009-12-01), Serrano et al.
patent: 7648056 (2010-01-01), Serrano et al.
patent: 19953316 (2001-05-01), None
patent: 2007109959 (2007-04-01), None
JPO machine translation of JP 2007109959 A, Apr. 26, 2007.
Alvarez Serrano Esteban Arturo
Fonseca Julián Martinez
Millán Sánchez Horman Armando
Rogitz John L.
Sony Corporation
Sony Electronics Inc.
Ward Jessica L
Yoon Kevin E
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