Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Reexamination Certificate
2007-09-14
2008-09-16
Bell, Bruce F (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
C205S096000, C205S157000, C427S304000, C427S437000, C427S443100
Reexamination Certificate
active
07425256
ABSTRACT:
An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system. At least one selective shield material flow mechanism is used in a selective shield material flow assembly.
REFERENCES:
patent: 4304641 (1981-12-01), Grandia et al.
patent: 5281325 (1994-01-01), Berg
patent: 5776327 (1998-07-01), Botts et al.
patent: 5985123 (1999-11-01), Koon
patent: 7288177 (2007-10-01), Barrese et al.
patent: 2003/0038035 (2003-02-01), Wilson et al.
patent: 1-147627 (1989-06-01), None
Barrese Ralph A.
Gajdorus Gary
Hopkins Allen H.
Konrad John J.
Schaffer Robert C.
Bell Bruce F
Goodwin, Esq. Kerry B.
International Business Machines - Corporation
Scully , Scott, Murphy & Presser, P.C.
LandOfFree
Selective shield/material flow mechanism does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Selective shield/material flow mechanism, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Selective shield/material flow mechanism will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3983799