Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Controlling current distribution within bath
Reexamination Certificate
2007-10-30
2007-10-30
King, Roy (Department: 1742)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Controlling current distribution within bath
C205S133000, C205S157000, C204S22400M, C427S304000, C427S437000, C427S443100
Reexamination Certificate
active
10813351
ABSTRACT:
An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system. At least one selective shield material flow mechanism is used in a selective shield material flow assembly.
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Barrese Ralph A.
Gajdorus Gary
Hopkins Allen H.
Konrad John J.
Schaffer Robert C.
King Roy
Scully , Scott, Murphy & Presser, P.C.
Smith Nicholas A.
Steinberg, Esq. William H.
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