Selective rework apparatus for surface mount components

Metal fusion bonding – With means to cut or separate work – filler – flux – or product

Reexamination Certificate

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Details

C228S191000, C228S264000, C228S019000

Reexamination Certificate

active

07575146

ABSTRACT:
An apparatus for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.

REFERENCES:
patent: 5003160 (1991-03-01), Matsuo et al.
patent: 5128506 (1992-07-01), Dahne et al.
patent: 5560531 (1996-10-01), Ruszowski
patent: 7472818 (2009-01-01), Chapman et al.
patent: 2002/0000329 (2002-01-01), Hoffmeyer et al.
patent: 2005/0071993 (2005-04-01), Farooq et al.
patent: 2004253406 (2004-09-01), None
patent: WO9623616 (1996-08-01), None

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