Selective removal of resin coatings and related methods

Details Selective removal of resin coatings and related methods Selective removal of resin coatings and related methods

2006-04-04

2010-11-09

Wyrozebski, Kat (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

C156S241000, C156S583200, C225S003000, C225S005000, C225S007000, C225S021000, C225S024000, C225S028000, C225S031000, C225S042000, C225S091000, C225S094000, C225S096000, C225S096500, C030S136000, C029S244000, C029S426100, C029S426400, C029S426500, C029S762000, C250S370110, C015S104002, C083S111000, C428S040100

Reexamination Certificate

active

07828926

ABSTRACT:
The present invention provides assemblies and methods for selectively removing resin coatings from a radiation detector. A method includes positioning a cutting edge on a resin coating formed on a radiation detector. The method further includes positioning a bonding member on the resin coating, applying a force to the bonding member such that a portion of the resin coating is pulled away from the radiation detector, and cutting the resin coating so as to detach the portion of the resin coating pulled away from the detector, thereby selectively removing the portion of the resin coating from the radiation detector.

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