Selective removal of a single solder ball from an array of solde

Details Selective removal of a single solder ball from an array of solde Selective removal of a single solder ball from an array of solde

1994-08-10

1995-12-26

Ramsey, Kenneth J.

Metal fusion bonding

Process of disassembling bonded surfaces, per se

225 1, 225 93, H01L 2100

Patent

active

054780098

ABSTRACT:
A solder ball removal tool uses ultrasonic vibrations to remove specific solder balls from high density chips, substrate solder ball terminal connections, card or board solder ball connections, or other solder ball array for the purpose of customizing the electrical functionality of a module. The tool also allows for the removal of damaged or defective solder balls for the purpose of replacement with defect free solder balls.

REFERENCES:
patent: 4417679 (1983-11-01), Shields
patent: 5170929 (1992-12-01), Long et al.
Research Disclosure, May 1992 No. 337 item 33739 by Kenneth Mason Publication Ltd.

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