Selective reference plane bridge(s) on folded package

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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C174S254000, C174S253000

Reexamination Certificate

active

07057116

ABSTRACT:
An apparatus including a substrate having dimensions suitable as a support circuit for at least one integrated circuit, the substrate comprising a laterally extending plication region defining first and second longitudinal portions; a plurality of conductive traces distributed in a first distribution plane of the substrate and extending transversely through the plication region; a first and second layers of conductive material in a second distribution plane of the first portion and second portion, respectively, of the substrate; at least one conductive bridge extending transversely through less than the entire plication region in the second distribution plane and coupled to the first continuous layer and to the second continuous layer; and at least one externally accessible contact point coupled to at least one of the first and second layers. A method of forming a support circuit and a system including a package.

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