Selective process for printing circuit board manufacturing

Details Selective process for printing circuit board manufacturing Selective process for printing circuit board manufacturing

1991-02-08

1993-10-05

Bell, Mark L.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 128, 502328, 502330, B05D 310, B01J 2358

Patent

active

052501051

ABSTRACT:
A new family of palladium based metallization catalyst compositions is diosed.
These catalysts are used in a process for the selective deposition of a metal on a substrate when a metallization mask (i.e. a plating resist) is used over the substrate.
Processes and compositions are also disclosed for manufacturing printed circuit boards, by using two metallization sequences, or one alone the latter comprising a so-called "selective process."
The process and composition are generally employed for the electroless plating of substrates, namely the metallization of plastics, ceramics, anodized aluminum and other materials.

REFERENCES:
patent: 40198910 (1977-04-01), Mallory, Jr.
patent: 3431120 (1969-03-01), Weisenberger
patent: 3798050 (1974-03-01), Franz et al.
patent: 3993807 (1976-11-01), Stabenow et al.

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