Selective planarization apparatus

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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216 38, 437228, H01L 2100

Patent

active

056456751

ABSTRACT:
Technique and apparatus for planarizing microsteps on a substrate by compressing the surface to be smoothed against a frozen layer of an etchant, where the compressive force is sufficient to melt the etchant at the contact edges between said microsteps and said etchant.

REFERENCES:
patent: 5399528 (1995-03-01), Leibovitz et al.

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