Computer-aided design and analysis of circuits and semiconductor – Design of semiconductor mask or reticle
Reexamination Certificate
2011-04-12
2011-04-12
Chiang, Jack (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Design of semiconductor mask or reticle
C716S051000
Reexamination Certificate
active
07926002
ABSTRACT:
After layout design data has been modified using an OPC process, a repair flow is initiated. This repair flow includes analyzing the modified data to identify any remaining or new potential print errors in the layout data. Regions then are formed around the identified potential print errors, and a subsequent OPC process is performed only on the data within these regions using a different set of process parameters from the process parameters employed by the initial OPC process. This repair flow is iteratively repeated, where a different set of process parameter values for the subsequent OPC process is used during each iteration.
REFERENCES:
patent: 6684382 (2004-01-01), Liu
patent: 2002/0146628 (2002-10-01), Ota
patent: 2005/0234684 (2005-10-01), Sawicki et al.
Cobb Nicolas B.
Dudau Dragos S.
Word James C.
Banner & Witcoff , Ltd.
Chiang Jack
Mentor Graphics Corporation
Tat Binh C
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